Tera-Cleans Solutions’ unique RFEB style wet benches enable:

   pristine and stable SiHx terminated silicon surfaces

   no measureable oxides for >48 hours (by XPS)

  an oxide etching and surface cleaning process with no silicon consumption

The HT RFEB, combined with the DI-Exterminator Degas Unit, and the HT Lite utilize an integrated two step surface treatment process:

  etch step using dHF (degassed UPW and 49% HF), which segues automatically to an
   insitu-rinse step with the degassed UPW which has a DO level <0.1ppb

The Ultra-Clean and Ultra-Clean Plus semi-automated wetbench offers:

  the integration of a Verteq Sunburst Turbo Plus Megasonic process vessel for APM cleaning and oxide passivation,
  a high efficiency Quick Dump Rinse (QDR) vessel,
  a linear robotic transfer system

to go along with all of the HF RFEB and HT Lite features.

Wafer drying is accomplished with proven optimized processes in Microprocess Technology’s Avenger UP series SRDs.

Note:   HT= Hydrogen Terminating  DI= Dissolved Impurities   DO= Dissolved Oxygen