Infrared Vacuum Oven for surface organic contamination removal on semiconductor wafers.

Utilizes a low temperature process (300-400C) via IR radiation and convection heating in a reduced pressure and oxidizing ambient (UHP O2 or CDA) to remove: 
* IPA residues
* airborne contaminants (organics and dust) 
* organics that outgas from plastic boxes and carriers used for wafer handling and transporting
 
This batch processor can overcome post-wet cleaning recontamination issues that come with staging and queue times in R&D and manufacturing environments.

[1] If there is an IPA based dry (ie Marangoni style or IPA vapor dryer) used following the process pre-clean, then there will be organic residues on the surface. 

[2] Wafer surfaces inherently become recontaminated immediately after they are cleaned, so unless the wafers are put directly into the critical process tool (ie. epi, diffusion, CVD, ALD, metals, ion implants) then there will be an accumulating contamination layer being formed on the surfaces.

Both of these issues, which have been well documented, will act as barriers to achieving a pristine hydrophobic or hydrophilic surface.

The Tera-Dry Clean is manufactured and supported by Microprocess Technologies LLC, an established leader in the spin rinse dryer market.