semi-automated batch wet process station with recirculating and filtered etch bath for dHF oxide and nitride etching & insitu-rinsing of 100-300mm wafers,

  combined with an integrated degassing system capable of <0.1ppb level DO

  Main Features:

• High purity 50L PVDF RFEB vessel with integrated filtration and     heating units
• Robotic lift assembly with a customizable end effecter for any wafer cassette (100-300mm)
• Prizm touch screen PLC for process control and monitoring
• HF storage vessel and metered dosing system
• HF concentration monitoring system
• Degassing system with two Liquicel membrane contactors and Edwards XDS35i vacuum pump
• Dissolved oxygen monitoring system (2 sensors- for pre and post degas)
• UHP N2 purification, regulation and control for N2 sweeping and automated insitu-cleaning of the membrane contactors

HF RFEB Wet Bench

  Same functions and options as the HT Lite wet bench but without the integrated degassing system and is 28” shallower in depth

  Main Features:

• High purity 50L PVDF RFEB vessel with integrated filtration and heating units
• Robotic lift assembly with a customizable end effecter for any wafer cassette (100-300mm)
• Prizm PLC for process recipe control and monitoring
• HF storage vessel and metered dosing system
• HF concentration monitoring system